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DOWSIL™ 1-4173 Thermally Conductive Adhesive

概述
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单组份灰色，可流动导热胶，抗拉伸强度高

用途:

Bonding integrated circuit substrates
Adhering lids and housings
Base plate attachment
Heat sink attachment

优势:

Thermally conductive adhesive
No added solvents
1 part
Flowable, for self leveling or filling after dispense
Automated or manual dispensing
Heat cure with rapid, versatile processing controlled by temperature
Increases reliability with heat flow away from circuitry components

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

典型性能

剪切力 是否 650 psi
可流动 是否 true
固化类型 是否加成固化
基材是否塑料, 金属, 陶瓷
导热率 是否 1.8 W/m・K
抵御种类 是否抗紫外线, 热阻, 耐臭氧
无底涂剂的粘合力 是否无需底涂
无溶剂 是否 true
温度稳定性 是否弱/低, 强/高
热固化 是否 20 Minutes @ 150 Deg C, 30 Minutes @ 125 Deg C, 90 Minutes @ 100 Deg C
热固性 是否 true
硬度-Shore A 是否 92 Shore A
粘度是否 61000 mPa.s
线性热膨胀系数 是否 125 um/m/Deg C
组分是否单组份
自流平 是否 true
防水是否 true
颜色是否灰色