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  2. DOWSIL™ 1-4173 Thermally Conductive Adhesive

DOWSIL™ 1-4173 Thermally Conductive Adhesive

单组份灰色，可流动导热胶，抗拉伸强度高

用途:

  • Bonding integrated circuit substrates
  • Adhering lids and housings
  • Base plate attachment
  • Heat sink attachment

优势:

  • Thermally conductive adhesive
  • No added solvents
  • 1 part
  • Flowable, for self leveling or filling after dispense
  • Automated or manual dispensing
  • Heat cure with rapid, versatile processing controlled by temperature
  • Increases reliability with heat flow away from circuitry components

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

典型性能

  • Color 是 否 Grey
  • Flowable 是 否 Yes
  • Heat Cure 是 否 20 Minutes @ 150 Deg C, 30 Minutes @ 125 Deg C, 90 Minutes @ 100 Deg C
  • Primerless Adhesion 是 否 Yes
  • Shear 是 否 650 psi psi
  • Water Resistant 是 否 Yes
  • 导热率 是 否 1.8 W/m・K
  • 硬度-Shore A 是 否 92
  • 粘度 是 否 61000 mPa.s
  • 线性热膨胀系数 是 否 125 um/m/Deg C
  • 组分 是 否 单组份
  • 自流平 是 否 Yes
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