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true

光互连

无应力光学组件

云计算、按需娱乐和移动连接都在推动数据的指数级增长,同时推动传输速度和密度超越铜连接的功能限制。A因此,该行业正在探索新型解决方案以满足这些日益增长的需求。

为帮助我们的客户满足这一日益增长的需求,我们陶氏消费者解决方案团队开发了一类聚合物波导有机硅材料,有望帮助开发具有低损耗、低功耗的光互连。

为何选择有机硅?

由传统有机聚合物制造的聚合物波导材料可以提供使光学组件像如今的电子组件一样简单和低成本的可能性,但是它们不能承受标准电子制造工艺的压力。

聚合物波导有机硅材料的其他主要优点包括:

  • 强度损失低
  • 易加工性
  • 大批量生产
  • 耐用性

快速链接