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照明用灌封材料

凝胶和密封剂 - 电子和高级装配

为了更好地保护具有挑战性的电子产品

当特征和组件高于200微米或者整体布局较复杂或含有薄而敏感的电线或焊点时,陶氏有机硅凝胶和密封剂可提供更好的保护,以及比敷型涂料更快、更简单的固化方案。这些高度可加工的低模量材料即使在几厘米厚的层中也能有效固化,以提供灵活的保护,防止环境污染、振动和热应力。它们还具有优异的介电性能,可有效隔绝高压。

陶氏在该领域的多年经验使我们能够满足客户的独特需求,无论是更高的温度稳定性、粘度种类还是提供导电版本和其他特殊级别。凭借丰富的产品组合和多种解决方案,有机硅凝胶和密封剂可用于交通电子、电力电子和高级装配行业中的许多其他应用。

凝胶或密封剂?

有机硅凝胶和密封剂均具有出色的介电保护、热稳定性和对环境污染物的强密封性。密封剂通常提供更大的耐磨性和耐损伤性,使其成为保护大型元件或薄的敏感电线或焊点的首选方式。对于受热循环影响的应用来说,凝胶是首选的灌封方式,可提供最大的应力释放和介电绝缘。

什么最适合您的应用?

我们的密封剂产品组合通常分为三类:

  • 标准密封剂需要涂底漆的步骤,前提是需要强粘合力以进行额外保护。
  • 无底漆自粘合密封剂在固化过程中加热至100°C以上时会粘附在许多常见表面上。
  • 专用级别具有独特的性能和优点,如导热性、高透明度或符合军用规格。

 

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