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凝胶和灌封胶

灌封材料

用于LED照明的有机硅灌封材料

为LED灯和灯具提供更高的可靠性和保护

确保LED模块在最恶劣的条件下具有可靠的性能,并具有更好的密封性。陶氏的高流动性有机硅灌封材料可保护系统组件,包括连接器、电路模块和电源。

密封、缓冲、绝缘、保护

这些凝胶状材料是一类特殊的软密封剂,可为敏感电路提供高水平的机械和热应力消除。作为介电绝缘和让电路免受灰尘、湿气和其他污染物影响的保护措施,这些材料可以消除破坏性的热量并吸收组件噪声,同时可靠的导热系数和相对热指数可确保LED灯和灯具设计的长期稳定性和更低的使用使用寿命成本。选择加热或RT固化型材,以扩大制造灵活性并降低加工成本。

我们的有机硅灌封材料有多种产品系列,可用于不同的应用:

  • 标准凝胶 – 适用于需要热/机械冲击和振动衰减、优异的介电性能、灵活的固化安排以及在宽温度范围内(-45至150°C/-49至302°F)的物理和电气稳定性的应用,并与自动点胶设备兼容
  • 低温凝胶 – 适用于需要低温性能的应用
  • 增韧凝胶 – 适用于需要化学粘合和尺寸稳定性的场合
  • 特种凝胶 – 适用于需要低可提取物、紫外线(UV)固化或耐溶剂和燃油的应用

DISPLIX灌封工艺(youtube)
OSRAM Opto Semiconductors的可视应用团队与陶氏和Nordson DIMA合作,寻找灌封 DISPLIX椭圆形LED的概念验证。