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DOWSIL™ ME-1190 Adhesive Clear

概述
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One-part, heat cure, translucent, self-priming adhesive.

用途:

Die Attach Adhesive
Adhesive for PCB system assemblies

优势:

Proven excellent jet dispensability which enables:
- Design flexibility with fine, precise patterning
- Ease to optimize parameter for jet dispensing
Solvent-less, low viscosity
Well balanced thixo and flow properties
Relatively high Young's modulus
Volatile controlled

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

典型性能

固化特点 是否加热固化 > 100C
特性是否单组份
颜色是否 Translucent/Clear

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DOWSIL™ ME-1190 Adhesive Clear

用途:

优势:

性能

典型性能

目前没有捆绑价格

如需了解更多信息，请联系陶氏公司。