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DOWSIL™ EG-4000 Kit

High and low temperature stability gel, suitable for operating temperature ranging from -60°C to + 200°C in continuous mode and > 3,000 hours at 215°C. Soft gel for highly demanding stress-release applications.

用途:

  • The potting of IGBT modules used for power conversion
  • Industrial sensors and actuators, insulation of high voltage devices
  • Protection of PCB and sensitive devices operated at high temperatures

优势:

  • Stability of electrical and mechanical properties
  • No surface cracking
  • No delamination from housing
  • Heat cure with low viscosity

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

典型性能

  • 单组分或双组分 双组份
  • 固化特点 加热固化 > 100C
  • 特性 自吸附粘合
  • 硬度 极限应力消除凝胶 < 150 gram 硬度
  • 粘度/流动性 高流量 500 - 3000 cps
  • 颜色 透明对比色

The new DOWSIL™ EG-4000 Dielectric Gel provides cost-effective protection at high operating temperatures to support next-generation PCB modules. DOWSIL™ EG-4000 is a soft Dielectric Gel within the 4XXX product family that is helping answer evolving market needs for protection of compact components with increasing power densities.

While other products may degrade at high temperatures, DOWSIL™ EG-4000 provides heat resistance and adhesion even when exposed to accelerated aging at 215°C in an air oven for up to 2000 hours.

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DOWSIL™ EG-4000 Kit
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DOWSIL™ EG-4000 Kit
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