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DOWSIL™ 3-6753 Thermally Conductive Adhesive Kit

由双组分组成、灰色、导热粘合剂、热固化、低模量、低粘度、含有 7 mil(178 微米)玻璃珠、用于粘结层控制。

用途:

  • DOWSIL™ 3-6753 Thermally Conductive Adhesive is designed to provide efficient thermal transfer for the cooling of PCB system assembly modules in automotive applications

优势:

  • Mix ratio: 1 to 1
  • Highly flowable, self leveling
  • Versatile heat cure
  • Thermally conductive – provides heat flow away from components
  • Same as DOWSIL™ 3-6751 Thermally Conductive Adhesive, but with 7 mil glass beads for controlled Bond Line Thickness
  • No added solvents

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

物理特性

  • Dielectric Strength 450 volts per mil v/mil
  • Flowable Yes
  • 介电常数 100 Hz 4.71
  • 介电常数 100 kHz 4.65
  • 体积电阻率 7.2e+013 Ω・cm
  • 加热固化 10 Minutes @ 150 Deg C, 40 Minutes @ 125 Deg C, 50 Minutes @ 100 Deg C
  • 导热率 1 W/m・K
  • 延伸率 36 %
  • 拉伸强度 400 psi
  • 损耗因子 100 Hz 0.0045
  • 损耗因子 100 kHz 0.00013
  • 比重 @ 25C 2.32
  • 硬度-Shore A 69
  • 粘度(组分A) 10055 mPa.s
  • 粘度(组分B) 8725 mPa.s
  • 线性热膨胀系数 179 um/m/Deg C
  • 自流平 Yes
  • 颜色 Grey

Application Benefits

  • Primerless Adhesion Yes

加工-配方的优势

  • 组分 双组份

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DOWSIL™ 3-6753 Thermally Conductive Adhesive Kit
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DOWSIL™ 3-6753 Thermally Conductive Adhesive Kit
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