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DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler

A two-part RT curable 2.0 W/m·K low density Silicone Gap Filler. A soft and compressible material once cured. Specifically designed to dissipate the heat from EV battery and control unit modules to provide a reliable cooling solution due to the stability of properties during typical environmental exposure simulating the entire operating life of such a module.

用途:

  • 动力电池组装 电控单元模块组装

优势:

  • 导热
  • 良好的耐久性
  • 低密度,轻量化与降低总成本
  • 阻燃通过UL94V0测试
  • 设备维护成本低

低密度导热填缝剂,可靠的导热系数及性能,适用于电动汽车电池组装及轻量化设计。

电动汽车(EV)是一个新兴的蓬勃发展的市场,因此电动汽车电池组是一个关键的组成部分。热管理对电动汽车电池组的安全性和寿命至关重要。目前,导热填缝材料正逐渐成为电动汽车电池散热的一种关键的热界面材料。为了抓住这一快速增长的市场,陶氏化学公司开发了TC-5515 LT低密度导热填缝剂,该填隙材料重量轻(密度1.95 g/cm3)、导热性好(2.0 W/m·K)、性能可靠,适用于EV的电池组装及轻量化设计。

DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler Video

探索一种用于电动汽车电池组组装低密度热界面材料

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DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler
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DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler


该产品暂无在线法规信息说明书。


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如需了解更多信息,请 联系陶氏

DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler
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