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DOWSIL™ TC-4529

A non-curing gap filler designed to provide excellent thermal management at different bond line thicknesses while maintaining vertical position under various environmental conditions.

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

  • Dielectric Strength 160 volts per mil v/mil
  • Dielectric Strength (kV/mm) 6.3 kV/mm
  • Low Volatility true
  • Number of Parts 双组份
  • Resistance Type 热阻
  • Shelf Life 270 Days
  • Temperature Range -50 to 200 °C
  • Thermal Conductivity 3.2 Watts per meter K
  • Thixotropic Index 2
  • Viscosity 300000 mPa.s
  • Volume Resistivity 3.1e+013 ohm-centimeters

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DOWSIL™ TC-4529
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DOWSIL™ TC-4529


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DOWSIL™ TC-4529
如需了解该产品的经销商选项,请 联系陶氏