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DOWSIL™ TC-4040 Dispensable Thermal Pad

这是一款双组分,1:1的混合比例,4W/mk导热凝胶。它是一种可印刷或可点胶的导热凝胶,可以代替预制的导热垫片进行热传递、应力消除和减震。它也可以作为间隙填缝料,拥有可重工的性能。

用途:

  • 电信动力单元,以及其他需要4W/mk导热系数的工业电力单元
  • 电信设备,如基站、光模块、以太网交换机和路由器
  • 数据通讯设备,如高速固态硬盘

优势:

  • 由于具有更好的界面润湿性能,因此比等效的4W/mk预制导热垫片具有更好的散热性能
  • 相比预制导热垫片,具有较低的总拥有成本
  • 高可靠性的导热性能和机械性能
  • 优异的垂直应用抗滑移性能UL 94 V0

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

  • 25摄氏度下的工作时间(小时) 3
  • 体积电阻率 2E14 Ω・cm
  • 导热率 4.1 W/m・K
  • 硬度-Shore 00 60 Shore 00

 

易于点胶的填隙料,拥有出色的导热性和防止垂流,可实现高效组装

想要满足 5G 技术苛刻的要求吗?比如出色的导热性? 5G 设计要求更高的功率密度,但这会产生更多热量。该技术输出温度十分高,要求采用有助于散热的材料,例如 DOWSIL™ TC-4040 Dispensable Thermal Pad。

DOWSIL™ TC-4040 Thermal Pad是一种双组份热界面材料 (TIM) 和填隙料,可轻松进行点胶,而且拥有出色的导热性。该材料可支持室温或加速固化以及固化之前的垂直组装(得益于其出色的防止垂流性)。因此,DOWSIL™ TC-4040 Dispensable Thermal Pad 不仅可让 5G 技术正常运行,还能优化组装该技术的工艺。

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DOWSIL™ TC-4040 Dispensable Thermal Pad
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DOWSIL™ TC-4040 Dispensable Thermal Pad
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