[{"values":[{"value":"日本語-日本","languageCode":"ja-jp","link":"javascript:void(0);"},{"value":"中文","languageCode":"zh-cn","link":"javascript:void(0);"},{"value":"English-英语","languageCode":"en-us","link":"javascript:void(0);"}],"label":"JP","default":"ja-jp"},{"values":[{"value":"日本語-日本","languageCode":"ja-jp","link":"javascript:void(0);"},{"value":"中文","languageCode":"zh-cn","link":"javascript:void(0);"},{"value":"English-英语","languageCode":"en-us","link":"javascript:void(0);"}],"label":"CN","default":"zh-cn"},{"values":[{"value":"日本語-日本","languageCode":"ja-jp","link":"javascript:void(0);"},{"value":"中文","languageCode":"zh-cn","link":"javascript:void(0);"},{"value":"English-英语","languageCode":"en-us","link":"javascript:void(0);"}],"label":"US","default":"en-us"}]

DOWSIL™ TC-2022 Thermally Conductive Adhesive

A one-part gray, thermally conductive, heat cure adhesive whose heat cure rate is rapidly accelerated with heat, and with high tensile strength and 7 mil glass beads.

用途:

  • Bonding integrated circuit substrates
  • Heat sink attach, automated or manual dispensing
  • Engine, power and transmission control units
  • Sensors

优势:

  • Primerless adhesion to a variety of substrates
  • Heat curable at moderate temperatures (100°C)
  • Good thermal conductivity values (1.7W/mK)
  • No added solvents
  • No mixing of separate components required
  • Improved cost effectiveness with rapid/low temperature cure
  • Heat flow away from electronic components can increase reliability

此材料没有安全数据说明书
如需了解更多信息,请 联系陶氏

没有找到此材料按所选语言显示的销售规格

DOWSIL™ TC-2022 Thermally Conductive Adhesive
该产品暂无技术数据表
如需了解更多信息,请 联系陶氏

DOWSIL™ TC-2022 Thermally Conductive Adhesive


该产品暂无法规信息说明书


DOWSIL™ TC-2022 Thermally Conductive Adhesive
如需了解该产品的经销商选项,请 联系陶氏