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DOWSIL™ SE 4486 Thermally Conductive Adhesive

Designed to provide efficient thermal transfer for the cooling of electronic modules, including home appliance devices. It is a one-part, white, moisture cure RTV, highly flowable, fast tack-free, high thermally conductive adhesive with controlled volatility.

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

  • Adhesion to 金属, 塑料, 陶瓷
  • Dielectric Constant at 1MHz 4.8
  • Dielectric Strength 500 volts per mil v/mil
  • Durometer - Shore A 81 Shore A
  • Dynamic Viscosity 19600 Centipoise
  • Elongation 43 %
  • Number of Parts 单组份
  • Resistance Type 耐臭氧, 抗紫外线
  • Room Temperature Cure - Hours 168 Hours
  • Shear 240 psi
  • Specific Gravity @ 25C 2.6
  • Temperature Range -45 to 200 °C
  • Tensile Strength 570 psi
  • Thermal Conductivity 1.6 Watts per meter K
  • Volume Resistivity 2e+014 ohm-centimeters

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DOWSIL™ SE 4486 Thermally Conductive Adhesive
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DOWSIL™ SE 4486 Thermally Conductive Adhesive


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DOWSIL™ SE 4486 Thermally Conductive Adhesive
如需了解该产品的经销商选项,请 联系陶氏