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DOWSIL™ SE 4450 Thermally Conductive Adhesive

High Thermal Conductivity, Gray, Fast cure, Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM 1 and ECU.

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

  • Adhesion to 金属, 陶瓷
  • Color 灰色
  • Cure Type 加成固化
  • Dielectric Constant at 1MHz 0.006
  • Dielectric Strength 560 volts per mil v/mil
  • Durometer - Shore A 95 Shore A
  • Elongation 46 %
  • Flowable true
  • Heat Cure 30 Minutes @ 150 Deg C
  • Number of Parts 单组份
  • Primerless Adhesion 无需底涂
  • Resistance Type 耐臭氧, 热阻, 抗紫外线
  • Self Leveling true
  • Shear 500 psi
  • Solventless true
  • Specific Gravity @ 25C 2.73
  • Temperature Range -45 to 200 °C
  • Temperature Stable 强/高, 弱/低
  • Tensile Strength 965 psi
  • Thermal Conductivity 1.92 Watts per meter K
  • Viscosity 66000 mPa.s
  • Volume Resistivity 3.3e+015 ohm-centimeters

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DOWSIL™ SE 4450 Thermally Conductive Adhesive
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DOWSIL™ SE 4450 Thermally Conductive Adhesive


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DOWSIL™ SE 4450 Thermally Conductive Adhesive
如需了解该产品的经销商选项,请 联系陶氏