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  2. DOWSIL™ SC 102 Compound

DOWSIL™ SC 102 Compound

A white, non-curing and non-flowing, thermally conductive compound. Designed to provide efficient thermal transfer for the cooling of electronic modules used in computer, power supply, and automotive applications.

性能

这些数值为典型性能，并且不用于在规格制定过程中使用。

  • Adhesion to 金属, 铝材, 塑料, FR4, 陶瓷
  • Color 白色
  • Dielectric Strength 50 volts per mil v/mil
  • Dielectric Strength (kV/mm) 2 kV/mm
  • Flowable true
  • Hydrophobic true
  • Low Odor true
  • Nonvolatile Content 99.7 %
  • Number of Parts 单组份
  • Polyesters true
  • Primerless Adhesion 无需底涂
  • Resistance Type 抗氧化, 耐臭氧, 耐溶剂性, 热阻, 抗紫外线, 防水
  • Temperature Stable 强/高, 弱/低
  • Thermal Conductivity 0.9 Watts per meter K
  • Volume Resistivity 2e+016 ohm-centimeters
  • Water Resistant true

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如需了解更多信息，请 联系陶氏。

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DOWSIL™ SC 102 Compound
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如需了解更多信息，请 联系陶氏。

DOWSIL™ SC 102 Compound


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DOWSIL™ SC 102 Compound
如需了解该产品的经销商选项，请 联系陶氏。