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DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit

Suitable for use in applications where there are frequent start/stops during the manufacturing process or where board and component complexity require more time for entrapped air to be displaced, rise to the surface, and break without requiring a vacuum de-airing step.

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

  • Application Temperature Range -45 to 200 °C
  • Dielectric Strength 450 volts per mil v/mil
  • Dielectric Strength (kV/mm) 18 kV/mm
  • Dissipation Factor at 100 kHz 0.001
  • Durometer - Shore A 60 Shore A
  • Heat Cure 3 Minutes @ 100 Deg C, 2 Minutes @ 150 Deg C
  • Linear CTE 300 um/m/Deg C
  • Mixing Viscosity 840 Centipoise
  • Number of Parts 双组份
  • Specific Gravity 1.25
  • Thermal Conductivity 0.35 Watts per meter K
  • Viscosity (Part A) 1020 mPa.s
  • Viscosity (Part B) 600 mPa.s

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DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit
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DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit


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DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit
如需了解该产品的经销商选项,请 联系陶氏