DOWSIL™ 2634 Coating
New alkoxysilane functional perfluoropolyether (PFPE) hybrid polymers that exhibit the synergistic effects of the oleophobicity and low coefficient of friction of fluoro-polymers and the hydrophobicity and durability of silicone. Improved abrasion and UV durability over current chemical treatments are obtained with the use of a mono-functional terminal alkoxy silane to the PFPE polymer. The alkoxy silane reactive end will covalently bond to the surface via hydrolysis and con-densation reactions, resulting in a structurally ordered chemical modi-fication of the surface. This covalent bond gives the needed durability in applications such as touch-screen displays.
- Color 是 否 无色变浅黄色
- Flash Point, Closed Cup 是 否 > 100 °C
- Nonvolatile Content 是 否 20 %
- Oil Resistance 是 否 true
- Resistance Type 是 否 耐磨损
- Shelf Life 是 否 450 Days
- Viscosity 是 否 1 mPa.s
- Water Resistant 是 否 true
DOWSIL™ ES-5612 Formulation Aid
This product's primary function is to produce W/Si and W/Si+O emulsions with textures that range from lotion to cream, leaving a light, nongreasy after feel on the skin. It is a low molecular weight ethoxylated silicone surfactant. It is a non-diluted material and allows addition level as low as 2%. This addition level needs to be increased up to 6% when working at lower W/Si-oil ratios. INCI Name: PEG-10 Dimethicone
DOWSIL™ 593 Fluid
Blend of polydimethylsiloxane and high molecular weight silicone resin that acts as a film former to provide water-repellency, wash-off resistance and durability in sun care, color cosmetics and lip stick formulations. INCI Name: Dimethicone (and) Trimethylsiloxysilicate
DOWSIL™ TC-5888 Thermally Conductive Compound
Gray, thixotropic, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.
DOWSIL™ 3140 RTV Coating
One-part, translucent adhesive or coating with good flowability, high elongation value for vibration/ mechanical shock dampening and low stress, good flame resistance, UL, IPC and Mil Spec tested, contains UV indicator.
SYLGARD™ 170 Silicone Elastomer Kit
Two-part, black, 1:1, RT or heat cure, low viscosity, general purpose, UL and Mil Spec.
DOWSIL™ 7091 Adhesive Sealant
High performance, neutral cure silicone adhesive/sealant.
XIAMETER™ PMX-6079 Fluid
Hexamethyldisilazane. The product can be used for filler treatment to make hydrophobic.
DOWSIL™ TC-2035 Adhesive A/B Kit
Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.
DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
A soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.
DOWSIL™ SE 9187 L Adhesive
One-part, black, clear or white, fast tack-free, controlled volatility adhesive with very low viscosity suitable for display module assembly, PCB protection (conformal coating) and general potting.
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