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DOWSIL™ 2634 Coating

New alkoxysilane functional perfluoropolyether (PFPE) hybrid polymers that exhibit the synergistic effects of the oleophobicity and low coefficient of friction of fluoro-polymers and the hydrophobicity and durability of silicone. Improved abrasion and UV durability over current chemical treatments are obtained with the use of a mono-functional terminal alkoxy silane to the PFPE polymer. The alkoxy silane reactive end will covalently bond to the surface via hydrolysis and con-densation reactions, resulting in a structurally ordered chemical modi-fication of the surface. This covalent bond gives the needed durability in applications such as touch-screen displays.

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

  • Color 无色变浅黄色
  • Flash Point, Closed Cup > 100 °C
  • Nonvolatile Content 20 %
  • Oil Resistance true
  • Resistance Type 耐磨损
  • Shelf Life 450 Days
  • Viscosity 1 mPa.s
  • Water Resistant true
  • DOWSIL™ ES-5612 Formulation Aid
    This product's primary function is to produce W/Si and W/Si+O emulsions with textures that range from lotion to cream, leaving a light, nongreasy after feel on the skin. It is a low molecular weight ethoxylated silicone surfactant. It is a non-diluted material and allows addition level as low as 2%. This addition level needs to be increased up to 6% when working at lower W/Si-oil ratios. INCI Name: PEG-10 Dimethicone

  • DOWSIL™ 593 Fluid

    Blend of polydimethylsiloxane and high molecular weight silicone resin that acts as a film former to provide water-repellency, wash-off resistance and durability in sun care, color cosmetics and lip stick formulations. INCI Name: Dimethicone (and) Trimethylsiloxysilicate


  • DOWSIL™ TC-5888 Thermally Conductive Compound
    Gray, thixotropic, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.

  • DOWSIL™ 3140 RTV Coating
    One-part, translucent adhesive or coating with good flowability, high elongation value for vibration/ mechanical shock dampening and low stress, good flame resistance, UL, IPC and Mil Spec tested, contains UV indicator.

  • SYLGARD™ 170 Silicone Elastomer Kit
    Two-part, black, 1:1, RT or heat cure, low viscosity, general purpose, UL and Mil Spec.

  • DOWSIL™ 7091 Adhesive Sealant
    High performance, neutral cure silicone adhesive/sealant.

  • XIAMETER™ PMX-6079 Fluid

    Hexamethyldisilazane. The product can be used for filler treatment to make hydrophobic.


  • DOWSIL™ TC-2035 Adhesive A/B Kit
    Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.

  • DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
    A soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.

  • DOWSIL™ SE 9187 L Adhesive

    One-part, black, clear or white, fast tack-free, controlled volatility adhesive with very low viscosity suitable for display module assembly, PCB protection (conformal coating) and general potting.


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DOWSIL™ 2634 Coating
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DOWSIL™ 2634 Coating


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DOWSIL™ 2634 Coating
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