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DOW™ DFDB-7509 NT Linear Low Density Polyethylene Resin

This product is produced using UNIPOL™ process technology and is intended for use in thin-wall mirco-irigation tape applications. The main characteristics of this product are good extrudability and good surface appearance.

性能

这些数值为典型性能,并且不用于在规格制定过程中使用。

  • 2% Secant Modulus, MD (ASTM D790B) in MPa (psi) 448 (65000)
  • 2% Secant Modulus, TD (ASTM D790B) in MPa (psi) 448 (65000)
  • Anti-block false
  • Density (ASTM D792) 0.924 g/cm3
  • Melt Index (g/10min @190°C/21.6 kg) 1.9
  • Melting Point, DSC (Dow Method) in °C(°F) 126°C (258°F)
  • Slip false
  • Vicat Softening Point in °C(°F) 104°C (220°F)

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DOW™ DFDB-7509 NT Linear Low Density Polyethylene Resin
该产品暂无技术数据表
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DOW™ DFDB-7509 NT Linear Low Density Polyethylene Resin


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DOW™ DFDB-7509 NT Linear Low Density Polyethylene Resin
如需了解该产品的经销商选项,请 联系陶氏