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导热粘合剂解决方案

用于冷却元器件的粘合材料

随着电子和系统组件中元器件的数量密度和工作频率的增加,热量也随之增加。为了应对温度对传统粘合剂材料的挑战,让我们共同探索并帮助扩充您的集成选项,同时还可以优化您的加工和系统成本的有机硅解决方案。

我们的热粘合剂系列包括低粘度液体无垂流配方,并提供以下两种固化的解决方案,以满足您指定的规格需求:

  1. 单组分湿固化的产品提供简单的室温下固化,以最大程度降低设备需求
  2. 单组分或双组分热固化解决方案有助于加快加工和产出

我们的热固化导热有机硅在加工过程中不会产生明显的副产物,因此非常适合密闭应用,并且不需要机械紧固件或任何夹具。固化后,它们可以转化为坚固而柔韧的弹性体,为各种常见基材(包括金属、陶瓷和填充塑料)提供良好的无底漆附着力。

此外,我们所有的导热有机硅都可以帮助增强元件的设计,并通过填充形状各异的缝隙、降低界面电阻和实现非常均匀的胶层,同时补偿电路板偏差和轻微翘曲,来保证更大的制造灵活性。