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true

导热硅脂

使用导热硅脂将热阻最小化,从而最大程度地提高产品应用性能

对要求苛刻的电子和系统组件进行有效的热管理需要能够提供高体积电导率和低热阻的材料。我们的导热有机硅化合物配方允许高负载的导热填料,旨在实现非常薄的胶层厚度,便于加工及操作。

这些先进的有机硅解决方案可轻松流动以覆盖和填充不规则的表面,从敏感电子元件中将热量高效而有效地排出从而保护电子元件。我们的热化合物通过丝网印刷工艺或标准点胶设备涂敷,也是非固化的,可以减少设备需求、提高产量并降低总拥有成本。

快速链接

网络研讨会:使用新型有机硅粘合剂进行工艺优化的机会(英语)