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DOWSIL™ EG-4100 Kit

High temperature stability gel, suitable for operating temperature ranging from -40°C to + 200°C in continuous mode and > 3,000 hours at 215°C. Tough gel for increased resistance to delamination under thermal cycling.

用途:

  • The potting of IGBT modules for power converions
  • Protection of PCB and sensitive devices operated at high termperatures
  • Industrial sensors and actuators and insulation of high voltage devices

利点:

  • Protection for interconnections subject to thermal and mechanical stresses
  • Stability under harsh environmental conditions
  • No surface cracking or delamination from housing within a large temperature range

物性

これらの値は一般特性を表すもので、規格ではありません。

一般特性

  • 1 成分形または 2 成分形 はい いいえ 2液
  • カラー はい いいえ 対比色透明
  • 特性 はい いいえ 自己プライマー接着
  • 硬化特性 はい いいえ 加熱硬化 > 100 C
  • 硬度 はい いいえ 硬度150-300グラムの高応力緩和ゲル
  • 粘度/流動性 はい いいえ 高流動性500~3,000 cps

DOWSIL™ EG-4100 Dielectric Gel, a two part, low temperature tough gel, exhibits stability within temperatures ranging from -40°C to 215°C; its superb stability allows for high performance reducing field failures and warranty costs.

Increasingly, industry trends demand small components with higher power densities; these trends require a reliance on stronger gels that protect assemblies and their properties. DOWSIL™ EG-4100 displays self-healing qualities similar to a liquid whilst maintaining stability. These properties allow the product to protect fragile components from surface contaminants moisture, including electrical insulation for high voltages.

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DOWSIL™ EG-4100 Kit
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DOWSIL™ EG-4100 Kit
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