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DOWSIL™ 3-6753 Thermally Conductive Adhesive Kit

2 成分形、グレー、熱伝導性接着剤、熱硬化、低弾性、低粘度、結合面制御用の 7 mil (178 ミクロン) のガラスビーズを含む

用途:

  • DOWSIL™ 3-6753 Thermally Conductive Adhesive is designed to provide efficient thermal transfer for the cooling of PCB system assembly modules in automotive applications

利点:

  • Mix ratio: 1 to 1
  • Highly flowable, self leveling
  • Versatile heat cure
  • Thermally conductive – provides heat flow away from components
  • Same as DOWSIL™ 3-6751 Thermally Conductive Adhesive, but with 7 mil glass beads for controlled Bond Line Thickness
  • No added solvents

物性

これらの値は一般特性を表すもので、規格ではありません。

物理特性

  • セルフレベリング性 はい いいえ あり
  • 伸び はい いいえ 36 %
  • 体積抵抗率 はい いいえ 7.2e+013 Ω・cm
  • 外観 はい いいえ Grey
  • 引張強さ はい いいえ 400 psi
  • 比重(25℃) はい いいえ 2.32
  • 流動性 はい いいえ あり
  • 熱伝導率 はい いいえ 1 W/m・K
  • 硬化条件 はい いいえ 10 Minutes @ 150 Deg C, 40 Minutes @ 125 Deg C, 50 Minutes @ 100 Deg C
  • 硬度ショアA はい いいえ 69
  • 粘度(A液) はい いいえ 10055 mPa.s
  • 粘度(B液) はい いいえ 8725 mPa.s
  • 絶縁破壊強さ はい いいえ 450 volts per mil v/mil
  • 線熱膨張係数 はい いいえ 179 um/m/Deg C
  • 誘電正接(100 Hz) はい いいえ 0.0045
  • 誘電正接(100 kHz) はい いいえ 0.00013
  • 誘電率(100 Hz) はい いいえ 4.71
  • 誘電率(100 kHz) はい いいえ 4.65

使用上の利点

  • 接着性 はい いいえ あり

加工・処方上の利点

  • 1液 または 2液 はい いいえ 2液

この製品の有効な安全データシート(SDS)がありません
詳細については当社にお問い合わせください

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DOWSIL™ 3-6753 Thermally Conductive Adhesive Kit
この製品の技術データシートはオンラインでは取得できません
詳細については当社にお問い合わせください

CHOOSE

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DOWSIL™ 3-6753 Thermally Conductive Adhesive Kit
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