[{"values":[{"value":"日本語","languageCode":"ja-jp","link":"javascript:void(0);"},{"value":"中文-中国語(簡体字","languageCode":"zh-cn","link":"javascript:void(0);"},{"value":"English-英語","languageCode":"en-us","link":"javascript:void(0);"}],"label":"JP","default":"ja-jp"},{"values":[{"value":"日本語","languageCode":"ja-jp","link":"javascript:void(0);"},{"value":"中文-中国語(簡体字","languageCode":"zh-cn","link":"javascript:void(0);"},{"value":"English-英語","languageCode":"en-us","link":"javascript:void(0);"}],"label":"CN","default":"zh-cn"},{"values":[{"value":"日本語","languageCode":"ja-jp","link":"javascript:void(0);"},{"value":"中文-中国語(簡体字","languageCode":"zh-cn","link":"javascript:void(0);"},{"value":"English-英語","languageCode":"en-us","link":"javascript:void(0);"}],"label":"US","default":"en-us"}]

DOWSIL™ TC-8225 A/B Kit

Thermally Conductive Gap Filler is a soft and compressible material once cured, 2.5 W/m·K for PCB System Assembly applications, two part material curing at room temperature and 180 micron glass beads.

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DOWSIL™ TC-8225 A/B Kit
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DOWSIL™ TC-8225 A/B Kit


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DOWSIL™ TC-8225 A/B Kit
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