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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

A soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.

物性

これらの値は一般特性を表すもので、規格ではありません。

  • Color - Part A ホワイト
  • Cure Type 白金触媒硬化
  • Dielectric Constant at 1MHz 6.2
  • Dielectric Strength (kV/mm) 12 kV/mm
  • Durometer - Shore 00 40 Shore 00
  • Mixing Viscosity in Pas-sec 217
  • Number of Parts 2
  • Specific Gravity @ 25C 2.9
  • Thermal Conductivity > 2.5 Watts per meter K
  • Thixotropic Index 4
  • Viscosity - Part A 223 Pa.s
  • Viscosity - Part B 216 Pa.s
  • Volume Resistivity 2.6e+014 ohm-centimeters
  • Working Time 40 Minutes

類似製品

  • DOWSIL™ TC-4525 A/B

    A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.


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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler


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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
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