DOW CORNING® TC-5888 Thermally Conductive Compound Improves Production, Performance and Reliability of High-End Electronics
DOW CORNING TC-5888 Thermally Conductive Compound is commercially available worldwide. The company’s broad portfolio of advanced thermally conductive adhesives, encapsulants, gels and compounds are especially designed to enable improved performance for many of today’s most demanding applications.
About DowDuPont Materials Science Division
DowDuPont Materials Science, a business division of DowDuPont (NYSE: DWDP), combines science and technology knowledge to develop premier materials science solutions that are essential to human progress. The division has one of the strongest and broadest toolkits in the industry, with robust technology, asset integration, scale and competitive capabilities that enable it to address complex global issues. DowDuPont Materials Science’s market-driven, industry-leading portfolio of advanced materials, industrial intermediates, and plastics businesses deliver a broad range of differentiated technology-based products and solutions for customers in high-growth markets such as packaging, infrastructure, and consumer care. DowDuPont intends to separate the Materials Science Division into an independent, publicly traded company.
More information can be found at www.dow-dupont.com.
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AH&M Marketing Communications
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