_{Dow Corning today introduced new DOW CORNING® TC-5888 Thermally Conductive Compound. The latest addition to the Company's broad and growing portfolio of solutions for thermal management, the new material is tailored to address the design and manufacturing challenges associated with high-performance server applications. Courtesy of Dow Corning.}

Dow Corning, a wholly owned subsidiary of The Dow Chemical Company and a global leader in silicones, silicon-based technology and innovation, today introduced new DOW CORNING TC-5888 Thermally Conductive Compound. The latest addition to the Company’s broad and growing portfolio of solutions for thermal management, the new material is tailored to address the design and manufacturing challenges associated with high-performance server applications.

“With the continued growth in cloud computing, data networks and telecom infrastructure, the demand for reliable server designs continues to grow as quickly as the demands on their performance,” said Grace Zhang, strategic marketing manager, Dow Corning. “TC-5888 Thermally Conductive Compound addresses both of these challenges by combining excellent thermal management for improved server reliability with a flow profile that enhances both productivity and precision.”

TC-5888 Thermally Conductive Compound offers the highest bulk thermal conductivity in Dow Corning’s thermally conductive compound product portfolio. The material’s combination of high thermal conductivity (5.2 W/m.K) along with its ability to achieve thin Bond Line Thickness (BLT) of approximately 20 microns yields low thermal resistance of 0.05 (C.cm2/W). The end result is a thermal compound that efficiently dissipates heat to improve performance and reliability of high sensitive server processors.

New TC-5888 thermal compound also features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces – such as in between large server packages and corresponding heat sinks. TC-5888 Thermally Conductive Compound also offers low volatile content vs. competitive thermal compounds, allowing for more consistent rheology, application repeatability and easier screen printing overall.