DOWSIL™ SE 4450 Thermally Conductive Adhesive
High Thermal Conductivity, Gray, Fast cure, Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM 1 and ECU.
Properties
These values are not intended for use in preparing specifications.
Typical Properties
- Adhesion to Yes No Ceramic, Metal
- Color Yes No Grey
- Cure Type Yes No Addition Cure
- Dielectric Constant at 1MHz Yes No 0.006
- Dielectric Strength Yes No 560 volts per mil v/mil
- Durometer - Shore A Yes No 95 Shore A
- Elongation Yes No 46 %
- Flowable Yes No true
- Heat Cure Yes No 30 Minutes @ 150 Deg C
- Number of Parts Yes No One
- Primerless Adhesion Yes No Primerless
- Resistance Type Yes No Ozone Resistance, Thermal Resistance, UV Resistance
- Self Leveling Yes No true
- Shear Yes No 500 psi
- Solventless Yes No true
- Specific Gravity @ 25°C Yes No 2.73
- Temperature Range Yes No -45 to 200 °C
- Temperature Stable Yes No High, Low
- Tensile Strength Yes No 965 psi
- Thermal Conductivity Yes No 1.92 W/m・K
- Viscosity Yes No 66000 mPa.s
- Volume Resistivity Yes No 3.3e+015 Ω・cm
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
No sales specification could be found for this material in selected language
The following Rules apply:
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
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