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DOWSIL™ EG-4120 Kit

High temperature stability gel, suitable for operating temperature ranging from -40°C  to + 200°C in continuous mode and > 3,000 hours at 215°C . Tough gel for increased resistance to delamination under thermal cycling.

Uses:

  • Potting of IGBT modules used for power conversion
  • Protection of electronics and sensitive devices operated hat high temperatures
  • Industrial sensors and actuators
  • Insulation of high voltage devices

Benefits:

  • Stability of electrical/mechanical properties under harsh temperature conditions
  • No surface cracking or delamination from component housing
  • Protection of delicate circuits and interconnections from surface contaminats and moisture

DOWSIL™ EG-4120 Dielectric Gel is a two-part, tough, self-priming gel. This encapsulant’s uncompromised stability allows for un-impeded curing in a large temperature range between -40°C to 215°C for extended periods of time. DOWSIL™ EG-4120 Gel, much like its companion gels in the 4XXX series react during mixing to become tough soft gels.

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Please Contact Dow for additional information.

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DOWSIL™ EG-4120 Kit
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ EG-4120 Kit


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DOWSIL™ EG-4120 Kit
Please Contact Dow for distribution options available for this product.