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DOWSIL™ EG-3800

One-part, transparent heat cure gel suitable for low -60°C and high +200°C temperatures in certain operational conditions. Dielectric Gel is suitable for potting and protecting various PCB systems assemblies specially designed to protect power semiconductor modules dies and interconnects.

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DOWSIL™ EG-3800
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ EG-3800


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DOWSIL™ EG-3800
Please Contact Dow for distribution options available for this product.