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DOWSIL™ TC-8225 A/B Kit

Thermally Conductive Gap Filler is a soft and compressible material once cured, 2.5 W/m·K for PCB System Assembly applications, two part material curing at room temperature and 180 micron glass beads.

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Please Contact Dow for additional information.

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DOWSIL™ TC-8225 A/B Kit
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DOWSIL™ TC-8225 A/B Kit


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DOWSIL™ TC-8225 A/B Kit
Please Contact Dow for distribution options available for this product.