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DOWSIL™ TC-5630 Thermally Conductive Compound

Gray, flowable, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.

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Please Contact Dow for additional information.

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DOWSIL™ TC-5630 Thermally Conductive Compound
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ TC-5630 Thermally Conductive Compound


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DOWSIL™ TC-5630 Thermally Conductive Compound
Please Contact Dow for distribution options available for this product.