[{"values":[{"value":"Português do Brasil-Portuguese","languageCode":"pt-br","link":"javascript:void(0);"},{"value":"日本語-Japanese","languageCode":"ja-jp","link":"javascript:void(0);"},{"value":"中文-Chinese Simplified","languageCode":"zh-cn","link":"javascript:void(0);"},{"value":"English","languageCode":"en-us","link":"javascript:void(0);"}],"label":"BR","default":"pt-br"},{"values":[{"value":"Português do Brasil-Portuguese","languageCode":"pt-br","link":"javascript:void(0);"},{"value":"日本語-Japanese","languageCode":"ja-jp","link":"javascript:void(0);"},{"value":"中文-Chinese Simplified","languageCode":"zh-cn","link":"javascript:void(0);"},{"value":"English","languageCode":"en-us","link":"javascript:void(0);"}],"label":"JP","default":"ja-jp"},{"values":[{"value":"Português do Brasil-Portuguese","languageCode":"pt-br","link":"javascript:void(0);"},{"value":"日本語-Japanese","languageCode":"ja-jp","link":"javascript:void(0);"},{"value":"中文-Chinese Simplified","languageCode":"zh-cn","link":"javascript:void(0);"},{"value":"English","languageCode":"en-us","link":"javascript:void(0);"}],"label":"CN","default":"zh-cn"},{"values":[{"value":"Português do Brasil-Portuguese","languageCode":"pt-br","link":"javascript:void(0);"},{"value":"日本語-Japanese","languageCode":"ja-jp","link":"javascript:void(0);"},{"value":"中文-Chinese Simplified","languageCode":"zh-cn","link":"javascript:void(0);"},{"value":"English","languageCode":"en-us","link":"javascript:void(0);"}],"label":"US","default":"en-us"}]

DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant

Two-part, 1 to 1 gray silicone elastomer, heat cure for manufacturing flexibility, thermally conductive encapsulant/pottant for electronics, providing protection from different environmental conditions and thermal management.

Properties

These values are typical properties and are not intended for use in preparing specifications.

  • Adhesion to Yes No Anodized Aluminum
  • Color Yes No Grey
  • Dielectric Strength (kV/mm) Yes No 24 kV/mm
  • Durometer - Shore A Yes No 60 Shore A
  • Elongation Yes No 95 %
  • Pot Life Yes No 130 Minutes
  • Shelf Life Yes No 180 Days
  • Solution Viscosity Yes No 2900 Centipoise
  • Specific Gravity Yes No 1.67
  • Tensile Strength Yes No 370 psi
  • Thermal Conductivity Yes No 1 Watts per meter K
  • Viscosity (Part A) Yes No 1600 mPa.s
  • Viscosity (Part B) Yes No 1900 mPa.s
  • Volume Resistivity Yes No 1.08e+015 ohm-centimeters
  • DOWSIL™ TC-4525 A/B

    A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.


  • DOWSIL™ 7091 Adhesive Sealant
    High performance, neutral cure silicone adhesive/sealant.

No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.

No sales specification could be found for this material in selected language

DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

Choose

DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant


No Regulatory Data Sheets are available for this product


DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant
Please Contact Dow for distribution options available for this product.