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DOWSIL™ TC-4529

A non-curing gap filler designed to provide excellent thermal management at different bond line thicknesses while maintaining vertical position under various environmental conditions.

Properties

These values are typical properties and are not intended for use in preparing specifications.

  • Dielectric Strength 160 volts per mil v/mil
  • Dielectric Strength (kV/mm) 6.3 kV/mm
  • Low Volatility true
  • Number of Parts Two
  • Resistance Type Thermal Resistance
  • Shelf Life 270 Days
  • Temperature Range -50 to 200 °C
  • Thermal Conductivity 3.2 Watts per meter K
  • Thixotropic Index 2
  • Viscosity 300000 mPa.s
  • Volume Resistivity 3.1e+013 ohm-centimeters

No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.

No sales specification could be found for this material in selected language

DOWSIL™ TC-4529
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ TC-4529


No Regulatory Data Sheets are available for this product


DOWSIL™ TC-4529
Please Contact Dow for distribution options available for this product.