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DOWSIL™ TC-2022 Thermally Conductive Adhesive

A one-part gray, thermally conductive, heat cure adhesive whose heat cure rate is rapidly accelerated with heat, and with high tensile strength and 7 mil glass beads.

Uses:

  • Bonding integrated circuit substrates
  • Heat sink attach, automated or manual dispensing
  • Engine, power and transmission control units
  • Sensors

Benefits:

  • Primerless adhesion to a variety of substrates
  • Heat curable at moderate temperatures (100°C)
  • Good thermal conductivity values (1.7W/mK)
  • No added solvents
  • No mixing of separate components required
  • Improved cost effectiveness with rapid/low temperature cure
  • Heat flow away from electronic components can increase reliability

There is no pre-treatment of surfaces required for this material, and in addition to the thermally conductive benefit, you also get the strong adhesion properties across a wide range of substrates, including:

  • AlClad
  • FR4
  • PBT
  • DOWSIL™ 1-4174 Thermally Conductive Adhesive
    One-part, grey, heat cure, thermally conductive, low flow, same as 1-4173 with 7 mil (178 micron) spacer beads, self-priming.

  • DOWSIL™ 3-6265 Thixotropic Adhesive
    One-part, black, heat cure, high strength, self-priming, contains UV indicator, non-flowing version of 3-6611. Suitable for use in automotive and industrial assembly areas including sealing lids and housings, attaching base plates gasket, and connector sealing.

  • DOWSIL™ EA-7100 Adhesive

    A one-part, thixotropic non-flowing adhesive, enabling design flexibility due to strong adhesion to a broad range of substrates.


  • SILASTIC™ RBL-9694-30P A&B Liquid Silicone Rubber
    A two-part, nonslumping, heat-cure liquid silicone rubber elastomer designed to be easily mixed, dispensed, and cured directly on automotive and other industrial components to form a compression gasket.

  • DOWSIL™ TC-4525 A/B

    A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.


  • DOWSIL™ 3-1953 Conformal Coating
    One-part, translucent, fast moisture RTV cure with mild heat acceleration possible, soft, stress-relieving, contains UV indicator.

  • DOWSIL™ X3-1598 Adhesive
    One-part, black, heat cure, moderate flow, high strength, self-priming, similar to Q3-6611 with UV indicator.

  • DOWSIL™ TC-2035 Adhesive A/B Kit
    Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.

  • DOWSIL™ OS- 20
    An ozone-safe volatile methylsiloxane (VMS) fluid developed specifically for use as a precision cleaning agent and carrier.

  • DOWSIL™ 1200 OS Primer
    An air drying primer supplied as a dilute solution of moisture reactive materials in volatile siloxane and is used to improve both the quality and speed of adhesion development to room temperature vulcanizing silicone sealants to a variety of common non-porous substrates.

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Please Contact Dow for additional information.

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DOWSIL™ TC-2022 Thermally Conductive Adhesive
No Technical Data Sheets are available online for this material.
Please Contact Dow for additional information.

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DOWSIL™ TC-2022 Thermally Conductive Adhesive


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DOWSIL™ TC-2022 Thermally Conductive Adhesive
Please Contact Dow for distribution options available for this product.