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DOWSIL™ SE 9100

One-part silicone formulation that achieves fast tack-free processing at room temperature with excellent flowability and sealing against water and contaminants.

DOWSIL™ SE 9100 Black Adhesive is a one-part silicone formulation that achieves fast tack-free processing at room temperature, providing fast in-line processing while allowing reworkability for electronics.

It is generally cured at room temperature and in an environment of 30 to 80 percent relative humidity, eliminating the need for curing ovens and the associated costs of energy and capital. Faster manufacturing throughput can be achieved since the adhesive and component can be handled in much shorter times of about 10 to 120 minutes, depending on the adhesive selected and the amount applied.

Greater than 90 percent of full physical properties should be attained within 24 to 72 hours and varies according to product. Mild heat below 60°C (140°F) may be used to increase through-put by accelerating the cure.

DOWSIL™ SE 9100 Adhesive retains its original physical and electrical properties over a broad range of operating conditions offering enhanced reliability, service life and cost-effective processing of mobile, display modules and other consumer devices.

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Please Contact Dow for additional information.

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DOWSIL™ SE 9100
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ SE 9100


No Regulatory Data Sheets are available for this product


DOWSIL™ SE 9100
Please Contact Dow for distribution options available for this product.