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DOWSIL™ SE 4450 Thermally Conductive Adhesive

High Thermal Conductivity, Gray, Fast cure, Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM 1 and ECU.

Properties

These values are typical properties and are not intended for use in preparing specifications.

  • Adhesion to Yes No Ceramic, Metal
  • Color Yes No Grey
  • Cure Type Yes No Addition Cure
  • Dielectric Constant at 1MHz Yes No 0.006
  • Dielectric Strength Yes No 560 volts per mil v/mil
  • Durometer - Shore A Yes No 95 Shore A
  • Elongation Yes No 46 %
  • Flowable Yes No true
  • Heat Cure Yes No 30 Minutes @ 150 Deg C
  • Number of Parts Yes No One
  • Primerless Adhesion Yes No Primerless
  • Resistance Type Yes No Ozone Resistance, Thermal Resistance, UV Resistance
  • Self Leveling Yes No true
  • Shear Yes No 500 psi
  • Solventless Yes No true
  • Specific Gravity @ 25°C Yes No 2.73
  • Temperature Range Yes No -45 to 200 °C
  • Temperature Stable Yes No High, Low
  • Tensile Strength Yes No 965 psi
  • Thermal Conductivity Yes No 1.92 Watts per meter K
  • Viscosity Yes No 66000 mPa.s
  • Volume Resistivity Yes No 3.3e+015 ohm-centimeters

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DOWSIL™ SE 4450 Thermally Conductive Adhesive
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DOWSIL™ SE 4450 Thermally Conductive Adhesive


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DOWSIL™ SE 4450 Thermally Conductive Adhesive
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