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DOWSIL™ Q1-9226 Thermally Conductive Adhesive

Typical applications include bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications. It is a two-part, gray, 1:1 mix ratio, heat cure, moderate flow, self-priming, thermally conductive adhesive.


These values are typical properties and are not intended for use in preparing specifications.

  • Adhesion to Metal, Aluminum, Plastic, FR4, Ceramic
  • Color Gray
  • Cure Type Addition Cure
  • Dielectric Strength 630 volts per mil v/mil
  • Durometer - Shore A 67 Shore A
  • Dynamic Viscosity 59000 Centipoise
  • Elongation 124 %
  • Flowable true
  • Heat Cure 60 Minutes @ 100 Deg C, 30 Minutes @ 150 Deg C
  • Hydrophobic true
  • Low Odor true
  • Number of Parts Two
  • Polyesters true
  • Primerless Adhesion Primerless
  • Resistance Type Oxidation Resistance, Ozone Resistance, Solvent Resistance, Thermal Resistance, UV Resistance, Water Resistance
  • Self Leveling true
  • Shear 375 psi
  • Shelf Life 360 Days
  • Solventless true
  • Specific Gravity @ 25C 2.14
  • Temperature Range -45 to 200 °C
  • Temperature Stable High, Low
  • Tensile Strength 600 psi
  • Thermal Conductivity 0.8 Watts per meter K
  • Thermosetting true
  • Viscosity (Part A) 48000 mPa.s
  • Viscosity (Part B) 43000 mPa.s
  • Volume Resistivity 1.9e+014 ohm-centimeters
  • Water Resistant true
  • Working Time 960 Minutes

No sales specification could be found for this material in selected language

DOWSIL™ Q1-9226 Thermally Conductive Adhesive
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ Q1-9226 Thermally Conductive Adhesive

No Regulatory Data Sheets are available for this product

DOWSIL™ Q1-9226 Thermally Conductive Adhesive
Please Contact Dow for distribution options available for this product.