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DOWSIL™ EG-4224 Dielectric Firm Gel Kit

Two-part, translucent, 1:1 mix ratio, fast room temperature cure gel with conditional primerless adhesion. Dielectric Gel is suitable for sealing and protecting various PCB system assemblies.

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Please Contact Dow for additional information.

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DOWSIL™ EG-4224 Dielectric Firm Gel Kit
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ EG-4224 Dielectric Firm Gel Kit


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DOWSIL™ EG-4224 Dielectric Firm Gel Kit
Please Contact Dow for distribution options available for this product.