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DOWSIL™ EG-4100 Kit

High temperature stability gel, suitable for operating temperature ranging from -40°C to + 200°C in continuous mode and > 3,000 hours at 215°C. Tough gel for increased resistance to delamination under thermal cycling.

Uses:

  • The potting of IGBT modules for power converions
  • Protection of PCB and sensitive devices operated at high termperatures
  • Industrial sensors and actuators and insulation of high voltage devices

Benefits:

  • Protection for interconnections subject to thermal and mechanical stresses
  • Stability under harsh environmental conditions
  • No surface cracking or delamination from housing within a large temperature range

DOWSIL™ EG-4100 Dielectric Gel, a two part, low temperature tough gel, exhibits stability within temperatures ranging from -40°C to 215°C; its superb stability allows for high performance reducing field failures and warranty costs.

Increasingly, industry trends demand small components with higher power densities; these trends require a reliance on stronger gels that protect assemblies and their properties. DOWSIL™ EG-4100 displays self-healing qualities similar to a liquid whilst maintaining stability. These properties allow the product to protect fragile components from surface contaminants moisture, including electrical insulation for high voltages.

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Please Contact Dow for additional information.

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DOWSIL™ EG-4100 Kit
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

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DOWSIL™ EG-4100 Kit


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DOWSIL™ EG-4100 Kit
Please Contact Dow for distribution options available for this product.