DOWSIL™ EA-7100 Adhesive
A one-part, thixotropic non-flowing adhesive, enabling design flexibility due to strong adhesion to a broad range of substrates.
- Design flexibility due to durable adhesion to a broad range of substrates
- Faster cure times and/or lower cure temperatures
- Adhesion that forms simultaneously with the cure to specific substrates
- Lower cure temperatures and/or faster cure times
- Low void formation
- Adhesion in harsh environments
- Good results from salt spray, water immersion and saltwater immersion testing
- Potential elimination of some cleaning steps
- Less sensitive to contamination
These values are typical properties and are not intended for use in preparing specifications.
- Dielectric Constant at 100 Hz Yes No 2.96
- Dielectric Constant at 100 kHz Yes No 2.91
- Dielectric Strength Yes No 437 volts per mil v/mil
- Dielectric Strength (kV/mm) Yes No 17 kV/mm
- Durometer - Shore A Yes No 43 Shore A
- Elongation Yes No 260 %
- Heat Cure Yes No 15 Minutes @ 100 Deg C
- Specific Gravity Yes No 1.09
- Tensile Strength Yes No 490 psi
- Thixotropic Index Yes No 5.8
- Viscosity Yes No 360000 mPa.s
There's a new chemistry on the road
To help increase design flexibility and cost control in electronics modules, Dow has created an innovative product family based on a technology not previously available.
DOWSIL™ EA-7100 Adhesive is a new silicone adhesive with adhesion to a greater range of substrates. This adhesive supports new designs that can improve performance and control costs in automotive and and other electronics applications.
The new adhesive can reduce electronic modules' costs by removing process steps, reducing cure time, lowering cure temperatures and more.
Award Winning Adhesives
Explore what the possibilities of Thermal Radical Cure™ chemistry can do for you.
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No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.