DOWSIL™ EA-1236 Base & Catalyst
Two-part, fast room temperature cure adhesive. Sealing lids and housings, parts fixing on circuit board. Performs well under typical automotive test conditions.
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DOWSIL™ Q1-9226 Thermally Conductive Adhesive
Typical applications include bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications. It is a two-part, gray, 1:1 mix ratio, heat cure, moderate flow, self-priming, thermally conductive adhesive.
DOWSIL™ TC-4525 A/B
A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.
DOWSIL™ 744 RTV Adhesive Sealant
One-part, white, moisture RTV, moderate flow, fast tack-free.
DOWSIL™ 7091 Adhesive Sealant
High performance, neutral cure silicone adhesive/sealant.
SYLGARD™ 170 Fast Cure Silicone Elastomer Kit
Two-part, black, 1:1, fast RT curing, low viscosity, general purpose, UL.
DOWSIL™ TC-2035 Adhesive A/B Kit
Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.