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DOWSIL™ 7920 Die Attach Adhesive

A one-part, black, flowable, high strength adhesive with self priming adhesion. It is a one-part, syringe dispensable, DRAM grade, die attach adhesive for microelectronics packaging.

Properties

These values are typical properties and are not intended for use in preparing specifications.

  • Color Yes No Black
  • Cure Type Yes No Addition Cure
  • Dielectric Constant at 100 Hz Yes No 2.82
  • Dielectric Constant at 100 kHz Yes No 2.81
  • Dielectric Strength Yes No 475 volts per mil v/mil
  • Dielectric Strength (kV/mm) Yes No 19 kV/mm
  • Dissipation Factor at 100 Hz Yes No 0.0011
  • Dissipation Factor at 100 kHz Yes No < 0.0002
  • Durometer - Shore A Yes No 72 Shore A
  • Elongation Yes No 25 %
  • Flowable Yes No true
  • Heat Cure Yes No 30 Minutes @ 150 Deg C
  • Number of Parts Yes No One
  • Primerless Adhesion Yes No Primerless
  • Printable Yes No true
  • Resistance Type Yes No Thermal Resistance
  • Shear Yes No 1000 psi
  • Specific Gravity @ 25C Yes No 1.2
  • Temperature Stable Yes No High, Low
  • Tensile Strength Yes No 500 psi
  • Viscosity Yes No 20000 mPa.s
  • Volume Resistivity Yes No 2.1e+015 ohm-centimeters

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Please Contact Dow for additional information.

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DOWSIL™ 7920 Die Attach Adhesive
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

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DOWSIL™ 7920 Die Attach Adhesive


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DOWSIL™ 7920 Die Attach Adhesive
Please Contact Dow for distribution options available for this product.