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DOWSIL™ 1-4174 Thermally Conductive Adhesive

One-part, grey, heat cure, thermally conductive, low flow, same as 1-4173 with 7 mil (178 micron) spacer beads, self-priming.

Properties

These values are typical properties and are not intended for use in preparing specifications.

  • Adhesion to Yes No Metal, Aluminum, Plastic, FR4, Ceramic
  • Color Yes No Grey
  • Cure Type Yes No Addition Cure
  • Dielectric Constant at 100 kHz Yes No 4.65
  • Dielectric Strength Yes No 400 volts per mil v/mil
  • Dissipation Factor at 100 kHz Yes No 0.0021
  • Durometer - Shore A Yes No 92 Shore A
  • Dynamic Viscosity Yes No 62300 Centipoise
  • Flowable Yes No true
  • Heat Cure Yes No 90 Minutes @ 100 Deg C, 30 Minutes @ 125 Deg C, 20 Minutes @ 150 Deg C
  • Hydrophobic Yes No true
  • Low Odor Yes No true
  • Number of Parts Yes No One
  • Polyesters Yes No true
  • Primerless Adhesion Yes No Primerless
  • Resistance Type Yes No Oxidation Resistance, Ozone Resistance, Solvent Resistance, Thermal Resistance, UV Resistance, Water Resistance
  • Self Leveling Yes No true
  • Shear Yes No 646 psi
  • Shelf Life Yes No 180 Days
  • Solventless Yes No true
  • Specific Gravity @ 25C Yes No 2.71
  • Temperature Range Yes No -45 to 200 °C
  • Temperature Stable Yes No High, Low
  • Thermal Conductivity Yes No 1.78 Watts per meter K
  • Thermosetting Yes No true
  • Volume Resistivity Yes No 1.9e+014 ohm-centimeters
  • Water Resistant Yes No true
  • DOWSIL™ TC-2035 Adhesive A/B Kit
    Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.

  • DOWSIL™ 1200 OS Primer
    An air drying primer supplied as a dilute solution of moisture reactive materials in volatile siloxane and is used to improve both the quality and speed of adhesion development to room temperature vulcanizing silicone sealants to a variety of common non-porous substrates.

  • DOWSIL™ 7091 Adhesive Sealant
    High performance, neutral cure silicone adhesive/sealant.

  • DOWSIL™ Q1-9226 Thermally Conductive Adhesive
    Typical applications include bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications. It is a two-part, gray, 1:1 mix ratio, heat cure, moderate flow, self-priming, thermally conductive adhesive.

  • DOWSIL™ 1-4173 Thermally Conductive Adhesive

    One-part gray, flowable thermally conductive adhesive with high tensile strength.


  • SILASTIC™ Q3-3636 Adhesive (Base & Catalyst)

    Two-part, low fogging RTV adhesive for headlamps (plastic and metal bonding).


  • DOWSIL™ 3-1953 Conformal Coating
    One-part, translucent, fast moisture RTV cure with mild heat acceleration possible, soft, stress-relieving, contains UV indicator.

  • DOWSIL™ TC-4525 A/B

    A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.


  • SYLGARD™ 527 A&B Silicone Dielectric Gel

    A two-part, 1 to 1 mix ratio dielectric gel that is suitable for sealing and protecting various electronic devices, especially those with delicate components.


  • DOWSIL™ 3-6265 Thixotropic Adhesive
    One-part, black, heat cure, high strength, self-priming, contains UV indicator, non-flowing version of 3-6611. Suitable for use in automotive and industrial assembly areas including sealing lids and housings, attaching base plates gasket, and connector sealing.

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Please Contact Dow for additional information.

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DOWSIL™ 1-4174 Thermally Conductive Adhesive
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

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DOWSIL™ 1-4174 Thermally Conductive Adhesive


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DOWSIL™ 1-4174 Thermally Conductive Adhesive
Please Contact Dow for distribution options available for this product.