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DOWSIL™ 1-2577 Low VOC Conformal Coating

One-part, clear, RTV cure with mild heat acceleration possible, hard slick finish with abrasion resistance, solvent-borne (VOC exempt in many areas), UL and Mil Spec, contains UV indicator.

Properties

These values are typical properties and are not intended for use in preparing specifications.

  • Dielectric Constant at 100 Hz Yes No 2.34
  • Dielectric Constant at 100 kHz Yes No 2.33
  • Dissipation Factor at 100 Hz Yes No 0.0011
  • Dissipation Factor at 100 kHz Yes No 0.0003
  • Durometer - Shore A Yes No 85 Shore A
  • Durometer - Shore D Yes No 25 Shore D
  • Low Odor Yes No true
  • Solvent Borne Yes No true
  • Temperature Range Yes No -45 to 200 °C
  • Viscosity Yes No 1050 mPa.s
  • Volume Resistivity Yes No 1.9e+014 ohm-centimeters
  • DOWSIL™ Q1-9226 Thermally Conductive Adhesive
    Typical applications include bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications. It is a two-part, gray, 1:1 mix ratio, heat cure, moderate flow, self-priming, thermally conductive adhesive.

  • DOWSIL™ 3-1953 Conformal Coating
    One-part, translucent, fast moisture RTV cure with mild heat acceleration possible, soft, stress-relieving, contains UV indicator.

  • DOWSIL™ TC-2035 Adhesive A/B Kit
    Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.

  • XIAMETER™ PMX-200 Silicone Fluid 5 cSt
    100% active, 5 cSt, polydimethylsiloxane polymer. INCI Name: Dimethicone

  • DOWSIL™ 7091 Adhesive Sealant
    High performance, neutral cure silicone adhesive/sealant.

  • SYLGARD™ 527 A&B Silicone Dielectric Gel

    A two-part, 1 to 1 mix ratio dielectric gel that is suitable for sealing and protecting various electronic devices, especially those with delicate components.


  • SYL-OFF™ 4000 Catalyst
    General purpose catalyst which is compatible with all Syl-off® brand solvent based and solventless release coating systems as well as Plantinum cure silicone PSAs.

  • DOWSIL™ TC-4525 A/B

    A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.


  • DOWSIL™ 1200 OS Primer
    An air drying primer supplied as a dilute solution of moisture reactive materials in volatile siloxane and is used to improve both the quality and speed of adhesion development to room temperature vulcanizing silicone sealants to a variety of common non-porous substrates.

  • DOWSIL™ 1-4174 Thermally Conductive Adhesive
    One-part, grey, heat cure, thermally conductive, low flow, same as 1-4173 with 7 mil (178 micron) spacer beads, self-priming.

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Please Contact Dow for additional information.

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DOWSIL™ 1-2577 Low VOC Conformal Coating
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Please Contact Dow for additional information.

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DOWSIL™ 1-2577 Low VOC Conformal Coating


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DOWSIL™ 1-2577 Low VOC Conformal Coating
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