DOWSIL™ 1-2577 Low VOC Conformal Coating
These values are typical properties and are not intended for use in preparing specifications.
- Dielectric Constant at 100 Hz Yes No 2.34
- Dielectric Constant at 100 kHz Yes No 2.33
- Dissipation Factor at 100 Hz Yes No 0.0011
- Dissipation Factor at 100 kHz Yes No 0.0003
- Durometer - Shore A Yes No 85 Shore A
- Durometer - Shore D Yes No 25 Shore D
- Low Odor Yes No true
- Solvent Borne Yes No true
- Temperature Range Yes No -45 to 200 °C
- Viscosity Yes No 1050 mPa.s
- Volume Resistivity Yes No 1.9e+014 ohm-centimeters
Frequently Bought Together
DOWSIL™ Q1-9226 Thermally Conductive Adhesive
Typical applications include bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications. It is a two-part, gray, 1:1 mix ratio, heat cure, moderate flow, self-priming, thermally conductive adhesive.
DOWSIL™ 3-1953 Conformal Coating
One-part, translucent, fast moisture RTV cure with mild heat acceleration possible, soft, stress-relieving, contains UV indicator.
DOWSIL™ TC-2035 Adhesive A/B Kit
Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.
XIAMETER™ PMX-200 Silicone Fluid 5 cSt
100% active, 5 cSt, polydimethylsiloxane polymer. INCI Name: Dimethicone
DOWSIL™ 7091 Adhesive Sealant
High performance, neutral cure silicone adhesive/sealant.
SYLGARD™ 527 A&B Silicone Dielectric Gel
A two-part, 1 to 1 mix ratio dielectric gel that is suitable for sealing and protecting various electronic devices, especially those with delicate components.
SYL-OFF™ 4000 Catalyst
General purpose catalyst which is compatible with all Syl-off® brand solvent based and solventless release coating systems as well as Plantinum cure silicone PSAs.
DOWSIL™ TC-4525 A/B
A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.
DOWSIL™ 1200 OS Primer
An air drying primer supplied as a dilute solution of moisture reactive materials in volatile siloxane and is used to improve both the quality and speed of adhesion development to room temperature vulcanizing silicone sealants to a variety of common non-porous substrates.
DOWSIL™ 1-4174 Thermally Conductive Adhesive
One-part, grey, heat cure, thermally conductive, low flow, same as 1-4173 with 7 mil (178 micron) spacer beads, self-priming.
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.