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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

A soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.

Properties

These values are not intended for use in preparing specifications.

Typical Properties

  • Color - Part A Yes No White
  • Cure Type Yes No Platinum-Catalyzed Cure
  • Dielectric Constant at 1MHz Yes No 6.2
  • Dielectric Strength Yes No 12 kV/mm
  • Durometer - Shore 00 Yes No 40
  • Mixing Viscosity in Pas-sec Yes No 217
  • Specific Gravity @ 25°C Yes No 2.9
  • Thermal Conductivity Yes No > 2.5 W/m・K
  • Thixotropic Yes No 4
  • Viscosity - Part A Yes No 223 Pa.s
  • Viscosity - Part B Yes No 216 Pa.s
  • Volume Resistivity Yes No 2.6e+014 Ω・cm
  • Working Time Yes No 40 Minutes

Easier processing and long-term performance stability 

As automotive electronics contribute ever greater value to automotive safety, reliability, performance and comfort, they are also generating higher temperatures that can reduce the functionality and reliability of modules over time.

Dow developed – and continues to broaden – a portfolio of silicone thermal conductive gap fillers with different levels of thermal conductivity that deliver greatly improved dispensability, reduced abrasiveness (certain products) and stable performance for more reliable applications in harsh automotive under the hood environments.

Thermally conductive gap fillers from Dow are soft, compressible, two-part silicone, high thermal conductivity materials specifically formulated to process easily and to effectively dissipate heat from critical automotive parts, such as engine or transmission.

DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K – bringing a number of benefits to your manufacturing or design:

  • Improved reliability in harsh temperatures – Effectively dissipate heat away from sensitive components. They withstand peak exposure at 200°C, and perform reliably at operating temperatures ranging up to 150°C.
  • Easy processing – These advanced thermally conductive materials dispense easily from their original packaging with minimal to no additional process preparation, making them well-suited for automated application using standard meter mix equipment.
  • Effective assembly – Avoid slumping on vertical surfaces during assembly. After cure, they maintain their vertical stability even after long use. 
  • Cost-effective, fast cure – The platinum cure system enables fast, controlled cure at room temperature, although cure times can be accelerated further with heat to reduce manufacturing cycle times. No post-cure steps are required.
  • UL 94 V-0 recognition – Received recognition under Underwriters Laboratories UL 94 standard, which evaluates the flammability of plastic and silicone materials intended for parts in devices and appliances. Recognition under UL 94 is a step toward applying the UL label on your final product.

No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.

No Food Contact Letters are available online for this material
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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
No Technical Data Sheets are available online for this material.
Please Contact Dow for additional information.

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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
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