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DOWSIL™ TC-2022 Thermally Conductive Adhesive

One-part gray, thermally conductive, heat cure adhesive with high tensile strength and 7 mil glass beads.

A one-part thermally conductive heat cure adhesive whose heat cure rate is rapidly accelerated with heat

There is no pre-treatment of surfaces required for this material, and in addition to the thermally conductive benefit, you also get the strong adhesion properties across a wide range of substrates, including:

  • AlClad
  • FR4
  • PBT

Features and benefits

  • Primerless adhesion to a variety of substrates
  • Heat curable at moderate temperatures (100°C)
  • Good thermal conductivity values (1.7W/mK)
  • No added solvents
  • No mixing of separate components required
  • Improved cost effectiveness with rapid/low temperature cure
  • Heat flow away from electronic components can increase reliability

Applications suitable for:

  • Bonding integrated circuit substrates
  • Heat sink attach, automated or manual dispensing
  • Engine, power and transmission control units
  • Sensors

No sales specification could be found for this material in selected language

DOWSIL™ TC-2022 Thermally Conductive Adhesive
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ TC-2022 Thermally Conductive Adhesive

No Regulatory Data Sheets are available for this product

DOWSIL™ TC-2022 Thermally Conductive Adhesive
Please Contact Dow for distribution options available for this product.