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DOWSIL™ TC-1996 Thermally Conductive Compound

Gray, flowable non-curing thermally conductive compound. Thermally Conductive Compound is suitable for use as a thermal interface material for PCB system assembly cooling.

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Please Contact Dow for additional information.

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DOWSIL™ TC-1996 Thermally Conductive Compound
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ TC-1996 Thermally Conductive Compound


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DOWSIL™ TC-1996 Thermally Conductive Compound
Please Contact Dow for distribution options available for this product.