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DOWSIL™ EG-3000 Thixotropic Gel Parts A&B

Two-part, heat cure, thixotropic gel.

Properties

These values are typical properties and are not intended for use in preparing specifications.

  • Adhesion to Yes No Metal, Aluminum, Plastic, FR4, Ceramic
  • Color Yes No Clear
  • Cure Type Yes No Addition Cure
  • Dielectric Constant at 100 kHz Yes No 2.7
  • Dielectric Strength Yes No 559 volts per mil v/mil
  • Durometer - Shore 00 Yes No 50 Shore 00
  • Dynamic Viscosity Yes No 2200 Centipoise
  • Heat Cure Yes No 60 Minutes @ 150 Deg C
  • Hydrophobic Yes No true
  • Low Odor Yes No true
  • Non-Slump Yes No true
  • Nonflowable Yes No true
  • Number of Parts Yes No Two
  • Optically Clear Yes No true
  • Polyesters Yes No true
  • Primerless Adhesion Yes No Primerless
  • Resistance Type Yes No Oxidation Resistance, Ozone Resistance, Thermal Resistance, UV Resistance, Water Resistance
  • Self Leveling Yes No true
  • Shelf Life Yes No 360 Days
  • Soft Gel Yes No true
  • Soft Stress Relieving Yes No true
  • Solventless Yes No true
  • Specific Gravity @ 25C Yes No 0.98 to 1.01
  • Temperature Range Yes No -45 to 170 °C
  • Temperature Stable Yes No High, Low
  • Thermosetting Yes No true
  • Thixotropic Yes No true
  • Volume Resistivity Yes No 2.7e+014 ohm-centimeters
  • Water Resistant Yes No true
  • Worked Penetration Yes No 91 mm/10
  • Working Time Yes No 360 Minutes
  • DOWSIL™ TC-2035 Adhesive A/B Kit
    Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.

  • DOWSIL™ ME-1070 Adhesive Black
    A one-part, black, flowable, high strength adhesive with self priming adhesion. It is a one-part, syringe dispensable, DRAM grade, die attach adhesive for microelectronics packaging.

  • DOWSIL™ 7091 Adhesive Sealant
    High performance, neutral cure silicone adhesive/sealant.

  • DOWSIL™ TC-4525 A/B

    A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.


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Please Contact Dow for additional information.

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DOWSIL™ EG-3000 Thixotropic Gel Parts A&B
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

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DOWSIL™ EG-3000 Thixotropic Gel Parts A&B


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DOWSIL™ EG-3000 Thixotropic Gel Parts A&B
Please Contact Dow for distribution options available for this product.