Minimize resistance, maximize performance with thermal greases
Effective thermal management for demanding electronics and systems assemblies require materials that can provide high bulk conductivity and low thermal resistance. Formulated to allow high loading of thermally conductive fillers and designed to achieve very thin bond line thicknesses, our thermally conductive silicone compounds are ready to go to work for you.
These advanced silicone solutions flow easily to cover and fill surface irregularities to provide efficient, effective dissipation of damaging heat away from sensitive components. Applied via screen or print processes or by standard dispensing equipment, our thermal compounds are also non-curing, allowing for reduced equipment needs, improved throughput and lowered total cost of ownership.