Dow Electrical & Telecommunications Focuses on the Value Beneath the Surface

Houston, Texas - March 11, 2014 -

Dow Electrical & Telecommunications is asking cable makers and utilities “Can you dig it?” – focusing on technology optimized for underground electrical infrastructure. The organization will participate at IEEE PES Transmission and Distribution Conference and Exposition, April 14-17 in Chicago, IL and will have experts on hand to talk about:

  • The concept of intelligent undergrounding and its feasibility across all voltage classes.
  • Strengths in DOW ENDURANCE™ HV compound offering for new and refurbished underground electrical infrastructure.
  • Investments in facilities, packaging and logistics operations to ensure continuing product quality and commitment to the power industry.
  • Continued proliferation of its advanced performance MV TR-XLPE compound – DOW ENDURANCE™ HFDC-4202 EC

In addition, Dow Electrical & Telecommunications will be giving a presentation during Forum 4: Insulated Conductors, Transmission & Distribution on Wednesday, April 16 from 8:00 a.m. to 10:00 a.m. The session, 14TD0104, Impact of Semiconductive Shield Quality on Accelerated Aging Cable Performance, will focus on the comparison of different commercial semiconductive shield compounds and how the results prove the correlation between cable longevity and reliability and the quality of shield material used in cable construction. Authors are: Paul Brigandi, Tim Person, Paul Caronia and Erik Groot-Enzerink.

Visit Dow Electrical & Telecommunications at IEEE PES T&D, Booth #6055. We’d really dig seeing you there.


For editorial information:

Kyle Bandlow
+1 989 638 2417
KBandlow@dow.com


Terri Howe
Howe Marketing Communications
+1 616 997 6235
thowe@howemarketing.com