Dow to Display “Active Comfort” Nonwovens Solutions at ANEX 2018

Tokyo, Japan - June 05, 2018 - Dow Packaging and Specialty Plastics (P&SP), a business unit of The Dow Chemical Company, will present its latest melt blown product, ASPUN™ MB Meltblown Fiber Resins at ANEX 2018, Asia’s leading nonwovens exhibition held June 6 – 8 in Tokyo, Japan. This innovative resin provides converters and brand owners unparalleled options for improved comfort and softness in nonwoven applications.

Under the theme “Active Comfort,” Dow will showcase its latest technologies and broad portfolio of resins underscoring how its nonwoven solutions help improve the well-being of consumers through reliable protection, discreetness and maximum comfort for active lifestyles.

ASPUN logoASPUN™ Meltblown Fiber Resins address the difficult challenges of increasing softness and comfort in fabrics such as bico-SMS nonwovens. As a result, this patent-pending family of polyethylene (PE) resins is an ideal solution for nonwovens in diapers, wipes, medical drapes and garments, sterilization packs, filtration and other hygiene and medical applications where increased softness provides added value.

“ASPUN™ MB Meltblown Fiber Resins offer customers and brand owners innovative solutions for softer nonwovens,” said Jayne Wong, global marketing director for Health and Hygiene, P&SP. “The need for softer, more cloth-like materials are key market trends for nonwoven products seeking to combine comfortable fit and outstanding performance.”

Dow’s exhibition booth will feature numerous product prototypes made with the latest technologies along with a prominent structure made with ASPUN™ Meltblown Fiber Resins so customers and brand owners can feel firsthand how this material exhibits softness and durability in a unique way.

The space will also showcase Dow’s comprehensive portfolio of resins for infant and adult hygiene applications along with how Dow is driving innovation through successful industry collaborations at Pack Studios—Dow’s global network of packaging experts and equipment. With eight locations around the world, Pack Studios brings together key contributors of the value chain to cultivate packaging innovations in a variety of markets and geographies.

Technology Presentation at ANEX 2018

On Thursday June 7, Dow will share the latest innovative solutions addressing comfort, fit and softness for fiber and nonwovens with a technical presentation from Lex Chen, Health & Hygiene application technology leader.

“By combining a broad portfolio of polyethylene resins, binding and coating solutions with excellent technical development and market expertise, Dow is well-positioned to help meet the demands of the nonwoven industry,” said Wong. “These unique capabilities enable us to deliver custom solutions with added functionalities and performance differentiation in many end-use applications.”

Visit Dow during ANEX 2018 in the Tokyo Big Sight International Exhibition Center at booth 2416 to learn more about how you can collaborate with Dow to bring new innovations to life.


For editorial information:

Nate Kerns
+65 6417 3803
kerns@dow.com